Two-stage high-precision visual inspection of surface mount devices

نویسندگان

  • Hong Kyu Chung
  • Rae-Hong Park
چکیده

A two-stage high-precision algorithm for detecting the orientation and position of the surface mount device (SMD) is described. In the preprocessing step, a coarse orientation of the SMD is obtained by line fitting. A high-precision fuzzy Hough transform (FHT) is applied to the corner points to estimate precisely the orientation of the device, with its position determined by using four detected corner points. The FHT employed has a real-valued accumulator over the limited range of angles that is determined in the preprocessing step. Computer simulation with a number of test images shows that the parameters obtained by the presented algorithm are more accurate than those by conventional methods such as the moment method, projection method, and Hough transform methods. It can be applied to fast and accurate automatic inspection and placement systems. © 1997 SPIE and IS&T. [S1017-9909(97)00904-5]

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

PCB Inspection for Missing or Misaligned Components using Background Subtraction

Automated visual inspection (AVI) is becoming an integral part of modern surface mount technology (SMT) assembly process. This high technology assembly, produces printed circuit boards (PCB) with tiny and delicate electronic components. With the increase in demand for such PCBs, high-volume production has to cater for both the quantity and zero defect quality assurance. The ever changing techno...

متن کامل

Automated Visual Inspection Algorithm for Solder Joint of Surface Mount Devices Based on Three Dimensional Shape Analysis

An automated visual inspection system has been developed for use with surface mount devices (SMDs) on a printed circuit board (PCB). The system is capable of inspecting minute solder joints of fine pitch components as small as 0.3mm pitch QFP leads. A solder joint is judged using a height image and an intensity image that are detected by a unique confocal height sensor. A solder joint is classi...

متن کامل

Reduced dimensionality space for post placement quality inspection of components based on neural networks

The emergence of surface mount technology devices has resulted in several important advantages including increased component density and size reduction on the printed circuit board, on the expense of quality inspection. Classical visual inspection techniques require time-consuming image processing to improve the accuracy of the inspected results. In this paper we reduce the computational comple...

متن کامل

Cleaning Process Development and Optimization in the Surface Mount Assembly Line of Power Modules

The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the exp...

متن کامل

Imaging Ladar for 3-D Surveying and CAD Modeling of Real-World Environments

To establish mobile robot operations and to realize survey and inspection tasks, robust and precise measurements of the geometry of the 3-D environment is a required basic sensor technology. For visual inspection, surface classification, and documentation purposes, however, additional information concerning reflectance of measured objects is necessary. High-speed acquisition of both geometric a...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • J. Electronic Imaging

دوره 6  شماره 

صفحات  -

تاریخ انتشار 1997